TECHNICAL GLOSSARY

Display, Touch & Embedded Technology Glossary

 

2-Wire Resistive – Resistive touch using two layers and edge electrodes; simpler but less accurate.

4-Wire Resistive – Common resistive touch with separate X and Y electrodes; stylus/glove friendly.

5-Wire Resistive – Resistive touch with electrodes on one layer for improved durability and stability.

A-B-A Bonding – Bonding stack sequence where adhesive is applied between multiple layers in order.

A-TW Polarizer – Polarizer type used to reduce IPS glow and improve black levels at angles.

ABI (Application Binary Interface) – Binary-level interface between compiled code, OS, and libraries.

Absolute Luminance – Display luminance measured independent of ambient light, typically in cd/m² (nits).

Accelerated Life Test (ALT) – Testing under elevated stress to estimate product lifetime.

Active Area – The addressable pixel region of a display, excluding bezel and inactive borders.

Active Matrix – Pixel addressing using an active switching device (e.g., TFT) per pixel.

Adaptive Brightness – Automatic backlight/emission adjustment based on ambient light sensing.

ADC – Analog-to-digital converter, transforms analog signals into digital values.

Adhesive Cure Time – Time needed for an adhesive to achieve specified strength/optical properties.

AEC-Q100 – Automotive electronics qualification standard for IC reliability.

AES – Advanced Encryption Standard used for secure data and firmware.

AFE – Analog front end; circuitry conditioning analog signals before conversion.

Afterimage – Temporary residual image caused by slow pixel relaxation or charge trapping.

AG Coating (Anti-Glare) – Surface treatment that diffuses reflections to reduce glare and sparkle.

Aging (Display) – Controlled run-in to stabilize luminance and identify early failures.

AHCI – Storage interface standard, often for SATA controllers.

AI (Artificial Intelligence) Upscaling – Video processing that increases apparent resolution using learned models.

AIDA64 – System diagnostics/benchmark tool sometimes used in embedded validation.

Air Bonding – Non-optical bonding where an air gap remains between layers.

Air Gap – Unbonded space between layers that can increase reflections and reduce contrast.

Aliasing – Jagged edges or artifacts from insufficient sampling or scaling.

Alphanumeric Display – Display intended primarily for letters and numbers (e.g., segmented or dot-matrix).

ALU – Arithmetic logic unit; CPU sub-block for calculations and logic.

AM (Active Matrix) TFT – TFT backplane used to actively drive pixels in LCD or OLED.

Ambient Light Sensor (ALS) – Sensor used to measure environmental light for brightness control.

AMOLED – Active-matrix OLED using a TFT backplane for pixel driving and storage.

Analog RGB – Video interface transmitting analog red/green/blue plus sync signals.

Anisotropic Conductive Film (ACF) – Adhesive film with conductive particles enabling Z-axis electrical connections.

Anisotropic Conductive Paste (ACP) – Conductive adhesive paste for fine-pitch interconnects, mainly Z-axis conduction.

Anode (OLED) – Electrode where holes are injected into the organic layers.

Anodization – Electrochemical process forming protective oxide layer on aluminum.

ANSI Contrast – Contrast measured using a checkerboard pattern to include stray light effects.

Anti-Aliasing – Technique that smooths edges by blending pixel values.

Anti-Fingerprint (AF) Coating – Oleophobic coating that reduces smudging and eases cleaning.

Anti-Newton Ring – Design/texture approach to reduce Newton rings in bonded stacks.

Anti-Reflective (AR) Coating – Optical coating that reduces surface reflections to improve contrast and readability.

AOD (Always-On Display) – Mode where a display shows minimal info continuously at low power.

AOI (Automated Optical Inspection) – Machine vision inspection used in PCB and assembly quality control.

AOSP – Android Open Source Project; base Android source used for embedded Android builds.

Aperture Ratio – Fraction of each pixel that transmits/emits light; higher improves efficiency.

API – Application programming interface; defined methods for software interaction.

APS – Advanced photo system; sometimes used as a reference term in imaging contexts.

ARC (HDMI Audio Return Channel) – HDMI feature sending audio from display back to receiver/soundbar.

ARM – CPU architecture widely used in embedded devices.

ASCII – Character encoding standard for text.

ASIC – Application-specific integrated circuit designed for a dedicated function.

Aspect Ratio – Relationship of display width to height (e.g., 16:9, 4:3).

ATA – Storage interface family including PATA/SATA.

AVR – Microcontroller family (also means audio/video receiver in AV contexts).

Back Porch – Video timing interval after sync pulse before active video starts.

Backlight – Light source behind an LCD (e.g., LED) providing illumination.

Backlight Bleed – Light leakage visible near edges or corners on dark content.

Backlight Driver – Power/control circuitry that regulates LED current and dimming.

Backlight Uniformity – Consistency of brightness across the screen area.

Backplane – Substrate and TFT circuitry that drives an LCD or OLED pixel array.

Banding – Visible steps in gradients due to limited bit depth or poor processing.

Bare Panel – Display panel without additional housing, cover lens, or mounting frame.

Bead Blasting – Surface texturing process used for anti-glare finishes on metal or glass.

BERT – Bit error rate test; method/equipment for validating high-speed links.

Bezel – Non-active border around the display; can include mechanical and optical margins.

Bezel Bond – Adhesive or mechanical bond between cover lens and surrounding frame.

BGA – Ball grid array IC package with solder balls under the device.

Binning (LED) – Sorting LEDs by brightness and color to ensure uniformity.

Bistable Display – Display that holds an image without continuous power (e.g., E-Ink).

Bit Depth – Number of bits used to represent color levels per channel.

Bit Error Rate (BER) – Rate of erroneous bits in a communication link.

Black Frame Insertion (BFI) – Motion technique inserting black frames to reduce perceived blur.

Black Level – Minimum luminance a display can produce; lower improves contrast.

Black Matrix – Opaque pattern used to block light leakage and hide non-active circuitry.

Blanking Interval – Non-visible portion of a video signal used for sync and timing.

BLE – Bluetooth Low Energy for short-range wireless connectivity.

Blooming – Halo around bright objects, common with local dimming backlights.

Blue Light Filter – Spectral modification to reduce blue emission for comfort/compliance.

Blue Phase LCD – LCD mode aimed at fast response using blue phase liquid crystals.

Bluetooth – Wireless standard for short-range device communication.

BOM (Bill of Materials) – List of components and materials required to build a product.

Bond Line Thickness (BLT) – Thickness of adhesive layer in a bonded assembly.

Bonding – Joining layers (e.g., cover glass to sensor/LCD) using adhesives or OCA.

Boost Converter – DC-DC converter that increases voltage.

Bootloader – Program that initializes hardware and loads the OS/kernel (e.g., U-Boot).

Bottom Emission OLED – OLED structure emitting light through the substrate side.

Brightness (Nits) – Perceived luminance of a display, typically measured in cd/m² (nits).

BSP (Board Support Package) – Software layer enabling an OS to run on specific hardware (boot, drivers, config).

Bubbles (Bonding) – Trapped air/voids in adhesive layers that reduce optical quality.

Buildroot – Tool for generating embedded Linux systems and root filesystems.

Burn-in – Permanent image retention, most associated with emissive displays like OLED.

Bézier Curve (UI) – Mathematical curve used for smooth UI animation and easing.

Cableset – Harness or set of cables/connectors used to integrate a module.

Cadence Detection – Video processing that identifies film/video frame cadence for deinterlacing.

CAN (Controller Area Network) – Robust serial bus used in automotive and industrial control networks.

Candela per Square Metre (cd/m²) – SI unit of luminance; 1 cd/m² is commonly referred to as 1 nit.

Capacitance – Electrical property that stores charge; used for capacitive touch sensing.

Capacitive Loading – Added capacitance on a line that can slow edges and degrade signal integrity.

Capacitive Touch – Touch detection via changes in capacitance, typically with a conductive finger.

Cathode (OLED) – Electrode where electrons are injected into the organic layers.

CCFL – Cold cathode fluorescent lamp, older LCD backlight technology.

CE Marking – EU conformity marking indicating compliance with relevant directives.

Cell Gap – Distance between LCD glass substrates that contains liquid crystal material.

Cell Matching (Touch) – Tuning touch sensor channels to equalize sensitivity.

Chemical Strengthening – Ion-exchange process (e.g., for glass) to improve strength.

Chirp (EMI) – Spread-spectrum modulation used to reduce peak emissions.

Chroma Subsampling – Reducing color resolution relative to luma (e.g., 4:2:2, 4:2:0).

Chrominance – Color component of a video signal, separate from luminance.

CIE – Commission Internationale de l'Éclairage; defines colorimetry standards.

CIE 1931 Color Space – Standard colorimetric model defining human color perception coordinates.

CISPR – Standards related to radio disturbance and EMC.

Cleanroom – Controlled environment minimizing particles for optics, bonding, and assembly.

Clock Jitter – Timing variation of a clock signal affecting sampling accuracy.

Closed-Loop Dimming – Brightness control using feedback to stabilize luminance.

CMOS – Semiconductor process; also imaging sensor type.

COB (Chip-on-Board) – Mounting bare die directly on PCB and encapsulating.

COF (Chip-on-Flex) – Mounting display driver IC on a flexible circuit.

COG (Chip-on-Glass) – Mounting driver IC directly on the LCD glass substrate.

Cold Start – Power-up from low temperature where response and viscosity can be impacted.

Color Accuracy – How closely displayed colors match a reference standard.

Color Depth – Number of representable colors; often linked to bit depth and processing.

Color Filter – RGB filter layer that creates color in LCDs.

Color Gamut – Range of colors a display can reproduce (e.g., sRGB, DCI-P3).

Color Shift – Change in color with viewing angle or aging.

Color Temperature – White point appearance expressed in Kelvin (e.g., 6500K).

Common Electrode (VCOM) – LCD reference electrode voltage used for pixel driving balance.

Compensation Film – Optical film used to improve viewing angle and reduce color shift.

Compliance Test – Formal testing to meet regulatory or customer standards (EMC, safety, etc.).

Conduction Cooling – Cooling by heat transfer through solids rather than airflow.

Conformal Coating – Protective coating applied to PCBs against moisture, dust, and corrosion.

Connector Keying – Mechanical feature preventing incorrect connector mating.

Contact Bounce – Rapid on/off transitions in mechanical switches when actuated.

Contrast Enhancement – Processing to increase perceived contrast, sometimes with artifacts.

Contrast Ratio – Ratio of white luminance to black luminance; higher implies deeper blacks.

Controller IC (Touch) – IC that scans the sensor matrix and reports touch coordinates to the host.

Cover Glass – Protective glass layer over a display/touch stack, often chemically strengthened.

Cover Lens – Top protective lens (glass or PMMA) above a touch sensor and/or display.

Cover Window – Transparent protective window over a display, not necessarily bonded.

CPLD – Complex programmable logic device.

CPU – Central processing unit that executes instructions.

CPU Load – Percentage of CPU utilization over time.

CRC – Cyclic redundancy check used for data integrity.

CRC32 – Common 32-bit cyclic redundancy check.

Cross-Talk (Display) – Unwanted coupling causing interference between channels or adjacent pixels.

Crosstalk (Touch) – Unwanted coupling between touch sensor channels affecting accuracy.

CSI (Camera Serial Interface) – MIPI interface standard for camera data transmission.

CTQ (Critical to Quality) – Parameter that must be controlled to meet quality requirements.

Curing (UV) – Hardening of adhesive/resin using ultraviolet light.

Cycle Time – Time to complete a manufacturing process step.

DC Bias – Net DC component that can cause LCD image sticking if not controlled.

DC-DC Converter – Power converter changing DC voltage levels.

DCR (Dynamic Contrast Ratio) – Marketing metric using variable backlight; not equal to native contrast.

DDR – Double data rate memory interface used for high bandwidth RAM.

DDR4 – Fourth-generation double data rate SDRAM.

DDR5 – Fifth-generation double data rate SDRAM.

De-gassing – Removal of trapped gases to reduce bubbles in adhesives and assemblies.

De-rating – Operating components below maximum rating to improve reliability.

Dead Pixel – Pixel that does not function correctly (stuck off or stuck on).

Debounce (Touch) – Filtering to prevent false touches from noise or bouncing contacts.

Deinterlacing – Conversion of interlaced video to progressive frames.

Delta E (ΔE) – Metric of color difference between measured and reference color.

Derating Curve – Graph showing allowable power/current vs temperature.

Device Tree – Data structure describing hardware to the Linux kernel (DTS/DTB).

DFS – Dynamic frequency scaling for power/performance control.

Dielectric – Insulating material that supports an electric field without conducting.

Differential Pair – Two conductors carrying equal-and-opposite signals for noise immunity (e.g., LVDS).

Diffuser Plate – Backlight component that evens out light distribution.

Digital Signage – Commercial display applications for advertising/information.

Direct Bonding – Bonding method without an air gap, typically optical bonding.

Direct-Lit Backlight – Backlight with LEDs behind the panel for improved uniformity/local dimming.

Display Driver IC (DDIC) – IC that generates gate/source drive signals for LCD/OLED panels.

Display Timing – Set of parameters (sync, porches, pixel clock) defining how frames are transmitted.

DisplayPort – Digital display interface supporting high bandwidth and features like MST.

Dithering – Technique to simulate higher bit depth using spatial/temporal patterns.

DLP – Digital light processing projection technology using micromirrors.

DMA – Direct memory access; moves data without CPU intervention.

DMM – Digital multimeter used for electrical measurements.

DoE – Design of experiments methodology for process optimization.

Dot Pitch – Distance between adjacent pixels or subpixels; smaller supports higher PPI.

DP Alt Mode – USB-C mode that carries DisplayPort signals over USB-C pins.

DPHY – MIPI physical layer for DSI/CSI over differential lanes.

DPI (Dots per Inch) – Measure of spatial resolution for printers or sometimes displays (often PPI for displays).

Driver – Software component that controls a hardware device and exposes an API to the OS.

DRM (Linux) – Direct Rendering Manager; Linux subsystem for graphics/display pipelines.

Drop Test – Mechanical reliability test simulating a fall.

DSC – Display Stream Compression used to reduce required link bandwidth.

DSC (Display Stream Compression) – Visually lossless compression used in DisplayPort/eDP to reduce bandwidth.

DSI (Display Serial Interface) – MIPI interface standard for connecting processors to display panels.

Dual-Channel LVDS – LVDS mode using two links to increase bandwidth for higher resolutions.

DVI – Digital Visual Interface for transmitting uncompressed digital video.

DVP – Digital video port, parallel camera/display interface used in some systems.

DVT (Design Verification Test) – Phase validating design meets requirements before production.

Dwell Time – Time a process/material spends in a given condition (heat, pressure, etc.).

Dynamic Contrast – Contrast enhancement using backlight or processing; differs from native contrast.

E-Coating – Electrodeposition coating for corrosion resistance on metals.

E-Paper – Reflective, bistable display technology such as electrophoretic ink.

Edge Blackening – Black paint/ink around cover glass edges to hide adhesives and improve aesthetics.

Edge Compensation – Firmware tuning to improve touch accuracy near bezels and edges.

Edge-Lit Backlight – Backlight where LEDs are at the edge and light is guided across the panel.

EDID – Display identification data that describes supported modes and capabilities.

eDP (Embedded DisplayPort) – DisplayPort variant designed for internal display connections (laptops/embedded).

EEPROM – Electrically erasable programmable read-only memory.

Electroluminescence – Light emission from a material under an electric field (OLED/EL).

EMC – Electromagnetic compatibility; ability to operate without emitting/suffering interference.

EMI Gasket – Conductive gasket providing shielding continuity between enclosures.

EMI Shielding (Touch) – Design methods to reduce electromagnetic interference affecting touch sensing.

Emissive Display – Display that emits its own light (e.g., OLED, microLED).

EMMC – Embedded MultiMediaCard flash storage commonly used in embedded systems.

EOL (End of Life) – Product/component no longer manufactured or supported.

ESD – Electrostatic discharge; sudden charge transfer that can damage electronics.

ESD Suppressor – Component (e.g., TVS diode) protecting circuits from electrostatic discharge.

ESR – Equivalent series resistance of a capacitor affecting ripple and losses.

FAT – File allocation table filesystem used on small storage media.

FCC – US regulatory compliance related to electromagnetic emissions.

FFC – Flat flexible cable used for high-density connections.

Field of View (FOV) – Angular extent of a displayed or viewed image.

Finger Tracking – Ability to continuously report finger movement across the sensor surface.

Firmware – Software running on embedded hardware, often stored in flash.

Flex Tail – Flexible circuit tail extending from a panel or sensor for connection.

Flicker – Visible temporal brightness variation, often tied to PWM dimming.

FMEA – Failure modes and effects analysis, systematic risk evaluation.

Forward Voltage (LED) – Voltage drop across an LED at a specified current.

FPC (Flexible Printed Circuit) – Flexible circuit used for connections between modules (e.g., touch FPC).

FPC Pitch – Center spacing between conductors on a flex cable; critical for connector matching.

FPC Stiffener – Reinforcement used on flex tails to improve connector insertion and reliability.

FPGA – Field-programmable gate array.

FPS – Frames per second; video frame rate measurement.

FPU – Floating point unit; CPU sub-block for floating-point math.

Frame Rate – Number of frames shown per second (Hz).

Fresnel Reflection – Reflection at an interface due to refractive index differences.

Front Porch – Video timing interval before sync pulse after active video ends.

FSTN – Film-compensated STN LCD mode with improved contrast vs STN.

Full Bond – Bonding approach with adhesive covering the entire active area.

Gamma – Nonlinear relationship between input signal and displayed luminance.

Gasket – Sealing component used for dust/water ingress control and mechanical tolerance.

Ghosting – Trailing artifacts due to slow pixel response or overdrive issues.

Glare – Reflections that reduce visibility and contrast.

Glass Transition Temperature (Tg) – Temperature where a polymer transitions from glassy to rubbery behavior.

Glove Touch – Touch capability with gloves, achieved via sensitivity tuning or sensor design.

GMS – Google Mobile Services; Google apps/services package for Android.

GMSL – Gigabit multimedia serial link used for automotive video transport.

GPIO – General-purpose input/output pins for digital control and sensing.

GPU – Graphics processing unit for rendering and video acceleration.

Gray-to-Gray (GtG) Response – Time for a pixel to change between gray levels; key for motion performance.

Ground Guard – Grounded trace pattern used to reduce noise and improve touch performance.

Ground Plane – Large conductive area used as a reference and for EMI control.

Guide Pin – Mechanical alignment pin used during assembly.

HAL (Hardware Abstraction Layer) – Software layer that abstracts hardware details from higher-level code.

HALT – Highly accelerated life testing to find design limits and failure modes.

Haptic Feedback – Tactile feedback using vibration or force to confirm interactions.

Hard Coat – Scratch-resistant coating applied to plastics or films.

HASS – Highly accelerated stress screening for production defect detection.

Haze – Measure of light scattering in a surface; higher haze reduces glare but softens image.

HDCP – High-bandwidth Digital Content Protection used on HDMI/DP links.

HDMI – Digital audio/video interface widely used for consumer and embedded displays.

HDR (High Dynamic Range) – Format/processing to display wider luminance range and richer highlights.

Heat Sink – Thermal component that dissipates heat into surrounding air or structure.

Heat Spreader – Plate distributing heat over a larger area for improved cooling.

High Brightness – Design optimized for high luminance in sunlight or bright environments.

HMI – Human-machine interface; the user interaction layer in industrial systems.

Hotspot – Area of localized higher brightness or temperature.

Hover Detection – Ability to detect a finger/stylus near the surface without physical contact.

HSync – Horizontal synchronization signal in raster video timing.

Hydrophobic Coating – Surface treatment that repels water to reduce wet false touches.

I/O – Input/output interfaces between a system and peripherals.

I2C – Two-wire serial bus for low-speed peripherals (touch controllers, sensors).

I3C – Improved successor to I2C with higher speed and in-band interrupts.

IC – Integrated circuit; packaged semiconductor device performing electronic functions.

IEC – International Electrotechnical Commission; standards body.

IEC 60601 – Medical electrical equipment safety standard often relevant to medical displays.

IGZO – Indium gallium zinc oxide semiconductor used for high-mobility TFT backplanes.

IIP3 – Third-order intercept point; RF linearity metric (occasionally relevant in EMC).

Illuminance (Lux) – Amount of light incident on a surface, measured in lux.

Image Retention – Temporary persistence of an image, usually recoverable (unlike burn-in).

IMU – Inertial measurement unit combining accelerometer/gyroscope (and sometimes magnetometer).

In-Cell Touch – Touch sensing integrated within the display stack (often within LCD cell).

In-Plane Switching (IPS) – LCD mode with good viewing angles and color stability.

Ingress Protection (IP Rating) – Rating of dust/water resistance (e.g., IP65).

Inrush Current – Initial surge current when power is applied, often charging capacitors.

Interface Board – PCB that adapts connectors/signals between modules and host systems.

Interrupt – Signal that causes the CPU to pause current work and service an event.

Inversion (LCD) – Polarity switching scheme to prevent DC bias across liquid crystals.

IO Expander – Peripheral that increases GPIO count via I2C/SPI.

IPC-A-610 – Industry standard for PCB assembly acceptability.

IS (Industrial Standard) Temperature – Common industrial operating range, often -20°C to +70°C (varies by spec).

ISO 7637 – Automotive transient electrical disturbance standard.

ISP – Image signal processor; processes camera sensor data.

ITO (Indium Tin Oxide) – Transparent conductive coating commonly used for capacitive touch electrodes.

IUP (In-Use Performance) – General term describing performance under real operating conditions.

I²S – Inter-IC sound serial bus for digital audio.

Jagged Edges – Stair-stepping artifacts from insufficient resolution or poor antialiasing.

JESD – JEDEC standards for high-speed serial interfaces in electronics.

Jitter Tolerance – Ability of a receiver to handle timing variation without errors.

JTAG – Debug/programming interface for microcontrollers and processors.

Kernel – Core of an OS managing resources, processes, memory, and device drivers.

Keypad – Input device with multiple discrete keys, sometimes integrated with a display module.

Lamination (Touch) – Process of bonding sensor/cover/adhesive layers without bubbles or misalignment.

LAN – Local area network.

LCD – Liquid crystal display; non-emissive, requires backlight.

LCM – Liquid crystal module; LCD panel plus support electronics/backlight.

LDO – Low-dropout voltage regulator.

LED – Light-emitting diode; semiconductor light source.

LED Backlight – Backlight that uses LEDs as the illumination source for LCDs.

LED Current Matching – Ensuring consistent current across LED strings for uniform brightness.

Lens (Optical) – Element shaping light distribution in backlights or indicators.

Light Guide Plate (LGP) – Acrylic plate distributing edge LED light across an LCD backlight.

Line Pair – Pair of lines used for differential signaling or for specific bus topologies.

Linearity (Touch) – How proportionally touch coordinates map to physical positions.

Linux Framebuffer – Kernel subsystem providing a simple pixel buffer interface to displays.

Liquid Crystal – Material whose optical properties change with electric field, used in LCDs.

Liquid Crystal Alignment – Orientation of LC molecules controlled by alignment layers and rubbing processes.

Local Dimming – Backlight control method that dims zones to improve HDR and black levels.

Low Power Mode – Operating state reducing power by lowering refresh, brightness, or disabling subsystems.

Luminance – Intensity of light emitted per unit area in a given direction (cd/m²).

Luminance Uniformity – Brightness consistency across the active area.

LUT (Look-Up Table) – Table used for gamma correction, color calibration, or signal mapping.

LUT Gamma – Gamma correction implemented via look-up tables.

LVDS – Low-voltage differential signaling used for many LCD panel interfaces.

MAC Address – Unique network hardware identifier for Ethernet/Wi‑Fi devices.

Main Board – Primary PCB containing CPU/SoC and key peripherals.

MCU – Microcontroller unit integrating CPU, memory, and peripherals.

Micro-LED – Display using microscopic inorganic LEDs as individual pixels; emissive and bright.

Middleware – Software layer between OS and applications (graphics, networking, etc.).

Mini-LED – Smaller LEDs used for high-zone-count backlights enabling local dimming.

MIPI – Mobile Industry Processor Interface standards for cameras and displays.

MIPI C-PHY – MIPI physical layer using 3-wire trios for higher efficiency than D-PHY in some cases.

MIPI D-PHY – MIPI physical layer using differential pairs for high-speed serial lanes.

MMC – Memory card standard and interface family.

MMI – Man-machine interface; another term for HMI.

Moiré – Interference pattern from sampling grids or overlapping repetitive structures.

MP (Mass Production) – Production phase after qualification, focused on volume builds.

MPU – Microprocessor unit; higher-performance processor typically requiring external memory.

MST (Multi-Stream Transport) – DisplayPort feature enabling multiple displays over one connection.

MTBF – Mean time between failures; reliability metric for repairable systems.

MTTP (Mean Time To Picture) – Metric sometimes used for signage reliability and availability.

MTTR – Mean time to repair; maintenance metric.

Multi-Touch – Ability to detect two or more simultaneous touch points.

Mutual Capacitance – Capacitive sensing method measuring coupling between transmit/receive electrodes.

Native Resolution – Physical pixel resolution of the panel; best quality occurs at native mapping.

NDA – Non-disclosure agreement.

Nit – Common term for 1 cd/m² of luminance.

Noise Immunity – Robustness against electrical noise (charger noise, EMI, LCD switching).

NRE – Non-recurring engineering costs for design, tooling, and development.

NTP – Network time protocol used to synchronize clocks.

NVM – Non-volatile memory that retains data without power (flash, EEPROM).

NVMe – Non-volatile memory express; high-speed storage protocol over PCIe.

OCA Lamination – Process applying optical clear adhesive film between layers under controlled conditions.

OCAP – Optically clear adhesive path (general term) for bonding stacks.

OCF – Optical compensation film used to improve viewing characteristics.

OD (Optical Density) – Measure of light attenuation; used for filters and sunglasses.

ODR – Output data rate; sensor reporting frequency.

OLED – Organic light-emitting diode display where each pixel emits light.

Operating Temperature – Temperature range over which a product meets specifications.

Optical Bonding – Bonding cover glass/touch to display using OCA/OCR to eliminate air gap reflections.

Optical Clear Adhesive (OCA) – Clear adhesive used for optical bonding to reduce reflections and improve robustness.

Optical Clear Resin (OCR) – Liquid adhesive resin cured (often UV) for bonding; can fill gaps and improve optics.

Optical Index Matching – Reducing reflections by matching refractive indices across interfaces.

OSD – On-screen display menu system for monitor settings.

OTA Update – Over-the-air firmware/software update.

Out-Cell Touch – Touch sensor placed above the display, separate from the LCD cell.

Outgassing – Release of volatile compounds that can fog optics or cause bubbles.

Overcurrent Protection – Circuitry that limits current to prevent damage.

Overdrive – Voltage boosting technique to accelerate LCD pixel transitions.

Overtemperature Protection – Circuitry that reduces load or shuts down when too hot.

Palm Rejection – Algorithm that ignores large-area contacts such as a resting palm.

PAPR – Peak-to-average power ratio; relevant in RF/EMI contexts.

Parallel RGB (TTL) – Digital RGB interface using multiple parallel data lines plus sync clocks.

PASM (Process and System Monitoring) – Monitoring of process parameters to maintain yield and quality.

PCAP (Projected Capacitive) – Capacitive touch using projected electric fields for accurate multi-touch.

PCB – Printed circuit board providing mechanical support and electrical connections.

PCB Stackup – Layer structure of a PCB defining impedance and routing constraints.

PCI – Peripheral component interconnect (legacy expansion bus).

PCIe – High-speed serial expansion interface used in embedded and PC systems.

PCT – Another abbreviation used for projected capacitive touch technology.

PFMEA – Process Failure Modes and Effects Analysis for manufacturing risk reduction.

Pigtail – Short cable assembly attached to a device for connection convenience.

Pixel Density (PPI) – Pixels per inch; higher PPI yields finer detail.

Pixel Mapping – Relationship between input signal pixels and physical display pixels.

Pixel Pitch – Center-to-center distance between pixels; used in LED walls and LCDs.

PLC – Programmable logic controller used in industrial automation.

PMIC – Power management IC controlling rails, sequencing, and regulation.

PMMA – Polymethyl methacrylate acrylic; used in light guides and cover windows.

PMOLED – Passive-matrix OLED, typically for small displays with lower complexity.

PoE – Power over Ethernet; supplies power and data over one Ethernet cable.

Polarizer – Optical film that controls light polarization in LCD stacks.

POR (Power-On Reset) – Reset sequence/state when power is applied.

PPAP – Production Part Approval Process used in automotive supply chains.

Prism Sheet – Backlight film that redirects light forward to increase on-axis brightness.

PVT – Production validation test phase before mass production.

PWM (Pulse-Width Modulation) – Method to control power/brightness by varying duty cycle.

QLED – Marketing term often indicating LCD with quantum dots; not emissive like OLED.

QSPI – Quad SPI interface for higher throughput flash access.

Quantum Dot Enhancement Film (QDEF) – Film that converts blue light to narrowband RGB for wider gamut LCDs.

Quiescent Current – Current consumed by a device when idle or with no load.

RAM – Random access memory.

RC Filter – Resistor-capacitor filter for noise reduction and timing.

REACH – EU regulation addressing chemical substances and safety.

Real-Time Operating System (RTOS) – OS designed for deterministic timing and real-time constraints.

Refresh Rate – How often the display updates per second (Hz).

Resolution – Number of addressable pixels, expressed as width × height.

Response Time – Time for pixels to change states; impacts motion blur.

Retarder Film – Optical film introducing phase delay to manage polarization in LCD stacks.

Retina Distance – Viewing distance at which pixels are not individually discernible (context-dependent).

RFI – Radio-frequency interference.

RoHS – Restriction of Hazardous Substances directive limiting certain materials.

Root Cause Analysis – Methodology to identify underlying causes of failures.

Root Filesystem (rootfs) – Filesystem containing the core user-space of an embedded Linux system.

RS-232 – Serial communication standard, often used for legacy control.

RS-485 – Differential serial bus for multi-drop industrial communication.

RTC – Real-time clock keeping time across power cycles.

Ruggedization – Design enhancements for shock, vibration, temperature, and environmental exposure.

Safe Area (UI) – Region where UI elements avoid rounded corners/notches/bezel occlusion.

Sample Rate – Rate at which a signal is measured or processed.

SATA – Serial ATA storage interface.

Saturation – Perceived intensity of color; higher saturation appears more vivid.

SBC (Single Board Computer) – Computer built on one PCB with CPU, memory, and I/O.

Scaling – Resampling of content to match the panel’s native resolution.

SCL – I2C clock line.

SDA – I2C data line.

SDK – Software development kit.

Secure Boot – Boot process that verifies signed code to prevent unauthorized firmware.

Self-Capacitance – Touch sensing method measuring capacitance of each electrode to ground.

Sensor Pitch (Touch) – Spacing of touch electrodes; affects resolution and SNR.

Signal Integrity – Quality of high-speed signals as affected by impedance, crosstalk, and noise.

Single-Touch – Ability to detect only one touch point at a time.

SMT – Surface-mount technology for PCB assembly.

SNR – Signal-to-noise ratio.

SoC (System-on-Chip) – IC integrating CPU/GPU and many system functions on one chip.

SoM – System-on-module; compact module containing SoC and key components.

Sparkle (AG Sparkle) – Granular appearance from anti-glare textures, noticeable on white backgrounds.

SPI – Serial Peripheral Interface, a high-speed synchronous serial bus.

Standoff – Spacer providing clearance and mechanical mounting separation.

Static Electricity – Accumulated charge that can lead to ESD events.

STN – Super twisted nematic LCD mode used for passive-matrix displays.

Stuck Pixel – Pixel locked at a value (often fully on or a primary color).

Stylus Support – Capability to detect an active or passive stylus with acceptable accuracy.

Subpixel – Individual red, green, or blue element that forms a full-color pixel.

Surface Capacitance – Older capacitive method measuring overall capacitance change at a surface layer.

Surface Finish – Final treatment of a surface affecting optics, feel, or adhesion.

TCON (Timing Controller) – Controller that converts video input to panel driving signals and timings.

TDDI – Touch and display driver integration; combines touch controller and DDIC functions.

Tearing – Visible split in frame updates when sync is not aligned (no VSync).

Temporal Dithering – Dithering over time to simulate intermediate levels with limited bit depth.

TFT – Thin-film transistor; active switch device used in display backplanes.

Thermal Cycling – Reliability test cycling temperature to induce mechanical/electrical stress.

Thermal Interface Material (TIM) – Material improving heat transfer between parts (pads, grease).

Thermal Runaway – Condition where temperature rise increases power, further raising temperature.

TN – Twisted nematic LCD mode with fast response but narrower viewing angles.

Touch Report Rate – Frequency of touch coordinate updates reported to the host (Hz).

Touch Resolution – Minimum distinguishable touch movement or position step size.

TPM – Trusted platform module used for hardware-based security.

TVS Diode – Transient voltage suppressor for protecting against surges/ESD.

U-Boot – Common open-source bootloader used in embedded Linux systems.

UART – Asynchronous serial communication interface commonly used for debug/console.

UART Console – Serial console interface for debug and boot logs.

UEFI – Unified Extensible Firmware Interface; modern firmware/boot standard.

UI – User interface.

USB – Universal Serial Bus interface for data and power.

USB-C – Reversible USB connector that can carry data, power, and alternate modes.

UV Aging – Exposure testing to evaluate yellowing and degradation under ultraviolet light.

V-by-One HS – High-speed panel interface used in large displays and TVs.

VA (Vertical Alignment) – LCD mode with high native contrast and good blacks.

VCOM – LCD common electrode reference voltage.

VESA – Standards body defining display interfaces, mounting patterns, and more.

VESA Mount – Standard mounting pattern for displays (e.g., 75×75, 100×100).

Viewing Angle – Angle range over which contrast/color remain acceptable.

VSync – Vertical synchronization aligning frame updates with display refresh.

Watchdog Timer – Hardware timer that resets a system if software becomes unresponsive.

Wet Touch Rejection – Algorithms and design measures to ignore water droplets as touches.

White Balance – Adjustment of RGB gains to achieve desired white point.

White Point – Chromaticity of the display’s reference white.

Wide Color Gamut (WCG) – Support for color spaces wider than sRGB (e.g., DCI-P3).

Wire Grid Polarizer – Polarizer type using metallic grids; can handle higher temperatures and brightness.

Wi‑Fi – Wireless LAN standard based on IEEE 802.11.

WLAN – Wireless local area network.

Yocto Project – Build system framework for creating custom embedded Linux distributions.

Z-Axis Force (Touch) – Measured touch pressure/force used for force sensing or improved interaction.

ZIF Connector – Zero insertion force connector commonly used for FPC/FFC terminations.